Thermal silica silica gel pad nip

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Thermal silica silica gel pad nip

Thermal silica silica gel pad nip


Thermal silica films generally inconvenient to smear grease used in some places, such as the motherboard power supply part, the heat is now the motherboard power supply part of relatively large, but mos pipe section is not flat, smear grease is not convenient, so You can paste the silicone sheet, or the next card heat sink, need a plurality of portions in contact with the different parts of the graphics above, grease is not, it can replace the silicone paper.


Thermal silica silica gel pad nip is a highly active adsorption material, is amorphous material, its chemical formula is mSiO2 · nH2O. Insoluble in water and any solvent, non-toxic, odorless, chemically stable, it does not react with any substance except alkali, hydrofluoric acid. Various types of silica because of the way they are formed of different porous structures. Chemical composition and physical structure of silica, determines that it has many other similar materials difficult to replace obtain characteristics: high adsorption properties, thermal stability, chemical stability, high mechanical strength.


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