Aluminum plate various characteristics

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Aluminum plate various characteristics

Aluminum plate (metal base heat dissipation plate (including aluminum plate, copper substrate, iron substrate)) is a low-alloyed Al-Mg-Si-based high ductility alloy plate having good thermal conductivity, electrical insulation properties and machining performance, aluminum plate compared to traditional FR-4, the same thickness, the same width, the aluminum substrate capable of carrying higher currents, aluminum plate pressure up to 4500V, the thermal conductivity of greater than 2.0, with aluminum plate in the industry as the Lord.


Using surface mount technology (SMT);


In the circuit design of thermal diffusion in a very effective treatment;


Reduce product operating temperature, increase the power density and reliability, extend product life;


Smaller footprint, lower hardware and assembly costs;


Replace the fragile ceramic substrates, better mechanical durability。


Copper clad aluminum is a metal circuit board materials, copper foil, thermal insulation layer and the metal substrate composition, its structure is divided into three layers:

Cireuitl。Layer line layer: the equivalent of the common PCB CCL, copper foil thickness loz line to 10oz。


DielcctricLayer Insulation: insulation layer is a layer of thermal insulation materials with low thermal resistance. Thickness: 0.003 "to 0.006" inch aluminum clad is where the core technology, has received UL certification. BaseLayer grass roots: a metal substrate, usually aluminum or copper can be selected. Aluminum clad and traditional epoxy glass cloth laminated panels.


PCB material has advantages compared to other materials unparalleled。 SMT surface mount power module for public art。


No radiator, greatly reduced, the cooling effect is excellent, good insulation properties and mechanical properties。


LED die substrate primarily as between the LED die and the system circuit board thermal energy derived medium, by wire bonding, eutectic or flip-chip process in combination with the LED die。 And based on thermal considerations, market LED die substrate mainly ceramic substrate mainly to different methods as standby system can be roughly divided into: a thick film ceramic substrate, low temperature co-fired ceramic, ceramic substrate and the thin film are three in the traditional high-power LED elements, or more thick film LTCC substrate is used as substrate cooling grain, then hit the gold-line LED die and ceramic substrate binding。 As the preface, this golden thread link limits the effectiveness of the heat loss along the electrode contacts。 Therefore, all domestic and foreign manufacturers and work towards solving this problem。 There are two ways to solve it, one is looking for a high heat transfer coefficient of the substrate material to replace aluminum containing silicon substrate, silicon carbide substrate, anodized aluminum plate or an aluminum nitride substrate, wherein the material of semiconductor silicon and silicon carbide substrates features that make this stage encountered harsher test, and anodized aluminum substrate is anodized oxide layer because of its lack of strength and easily lead to fragmentation due to conduction, so that it is limited in practical application, therefore, at this stage more mature and high degree of general acceptance is the aluminum nitride substrate as the heat; however, currently limited to the aluminum nitride substrate NA traditional thick-film process (after printing silver paste material subject to 850 ℃ atmosphere heat treatment, it appears material reliability issue), therefore, the line for an aluminum nitride substrate to prepare a thin film manufacturing process system。 Thin film process equipment made of an aluminum nitride substrate greatly accelerate the effectiveness of the system board via heat from the LED die to the substrate material, thus significantly reducing the burden on the heat generated by the LED die via a wire to the system board, and then to heat dispersion Effect。


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